Get Full Government Meeting Transcripts, Videos, & Alerts Forever!
Get email alerts on the Materials Science topic
No spam. Unsubscribe anytime.
Science presentation on polymer additive to reduce thermal expansion mismatch
Summary
A presenter describes a molecule that contracts when heated which, when added to polymers, reduces thermal expansion mismatch with metals and ceramics, improving durability for electronics and solar modules and allowing design flexibility.
Get email alerts on the Materials Science topic
No spam. Unsubscribe anytime.
This transcript records a scientific presentation in which an unnamed presenter described a molecule that contracts when heated and how it can be incorporated into polymers to reduce thermal expansion mismatch with metals, ceramics and glass. The presenter said the molecule is synthesized and substituted for a portion of the polymer's monomers so that the finished polymer expands less with heat and can behave more like a metal or ceramic. They said applications include electronics (such as cell phones), automotive and aeronautical components, military uses and renewable-energy components like foldable solar module back sheets, which the presenter identified as high-failure components due to daily and seasonal temperature fluctuations. The presenter noted that the additive reduces the need for fillers to control thermal expansion, freeing designers to use additives for other purposes such as additional UV stabilizers. They also said the discovery has been positively received by peer reviewers, with one reviewer calling the first manuscript —groundbreaking and pioneering.— No formal proposals, policy actions, votes or civic decisions are recorded in the transcript.

