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60% construction documents issued; early-release bids and April 28 community forum announced
Summary
The presenter said 60% construction documents were issued for estimating, with estimates due on the 10th and reconciliation on the 15th. Early-release bid packages for site work and miscellaneous metals are scheduled in April–May; a community forum on April 28 will outline construction logistics for families.
Presenter (S3) told the School Building Committee that 60% construction documents were issued Monday and that cost estimates from contractors are due on the 10th, with reconciliation scheduled on the 15th so the committee can 'true up the budget' by the next SBC meeting.
The presenter outlined early-release package #1 (site work, steel, concrete for foundations, foundation waterproofing and site electrical) with bid documents issued for bidding, bids due April 16 and targeting a May 14 release to address June work before the return to school. Early-release package #2 (miscellaneous metals) will go through an RFQ process with advertising and qualification dates in April and May.
On the regulatory front, the presenter summarized that structural, stormwater and traffic peer reviews are underway and that the planning board and Conservation Commission have continued hearings while reviewers produce comment letters. The presenter said ConCom’s next meeting is scheduled for the 31st and that the team hopes to resolve comments before awards are made so they do not add cost to the project.
Presenter (S3) announced an owner-led community forum on April 28 that will present construction logistics, timeline impacts, athletics and campus use during the summer and next school year; Committee member (S4) emphasized broad communications through principals, back-to-school nights and school channels to reach families.
The committee was told the design team is finalizing documents needed for cost estimating and that mass-timber design assistance and structural peer review comments are being addressed to support more accurate bids.
