DARPA Support Helps Laser Thermal Beat the Heat

Not specified · August 26, 2026

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1:53

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1:30

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Electronics overheating problem

Presentation

0:00 → 0:13(13s)

Presenter stated that electronics in both commercial and defense sectors face overheating and thermal-performance issues that limit platform reliability in the field.

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A single presenter described a measurement platform intended to address thermal challenges in electronics, credited DARPA and the EEI program with accelerating development, and outlined aims to commercialize the tools for applications including 5G/6G, electric-vehicle charging and battery technology.

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No transcript available.